(footprint "Solder_3P" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
  (tags "Through hole pin header THT 1x05 2.54mm single row")
  (attr through_hole)
  (fp_text reference "REF**" (at 0 -2.7) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d518c7db-9a4d-4905-902c-7b6d95f659cb)
  )
  (fp_text value "Solder_3P" (at 0 8) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 614f538e-5f2b-401d-b0ab-3346d3ff44e4)
  )
  (fp_text user "${REFERENCE}" (at -3.9 3.9 90) (layer "F.Fab") hide
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9586cda1-48da-45c7-86f7-751657e7c25a)
  )
  (fp_rect (start -2.8 -1.5) (end 2.8 6.5)
    (stroke (width 0.12) (type solid)) (fill none) (layer "F.SilkS") (tstamp 1be9f04b-c1d6-454e-ae88-97259404f025))
  (pad "1" smd roundrect (at 0 0) (size 4 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 174ecd2f-6484-485c-a83d-71d6a1dc733a))
  (pad "2" smd oval (at 0 2.54) (size 4 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 997a59d1-7e2b-4400-b74b-3cb21ad33038))
  (pad "3" smd oval (at 0 5.08) (size 4 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7aa5c04b-5bd3-4c72-bbaf-9ec87c5447e0))
)