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PCB v1.2 (finetune capsense pad size)
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@ -10,5 +10,5 @@
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp a78c44d6-409f-4574-88da-bbfbb5d29d39)
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)
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(pad "1" smd roundrect (at 0 0) (size 13.6 25.2) (layers "F.Cu") (roundrect_rratio 0.01923076923) (tstamp c91a4918-7c7b-44c4-a8fe-15b574de971a))
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(pad "1" smd roundrect (at 0 0) (size 14.3 25.7) (layers "F.Cu") (roundrect_rratio 0.01923076923) (tstamp c91a4918-7c7b-44c4-a8fe-15b574de971a))
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)
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@ -12,5 +12,5 @@
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)
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(pad "" np_thru_hole oval (at -3.4 -21) (size 2 2) (drill 2.1) (layers *.Mask) (tstamp 7be2db43-a2cf-4a25-af6d-7e74d20d8199))
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(pad "" np_thru_hole oval (at 3.4 -21) (size 2 2) (drill 2.1) (layers *.Mask) (tstamp b164a7c6-07ae-46ed-b74e-202bdc7cd652))
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(pad "1" smd roundrect (at 0 0) (size 13.6 25.2) (layers "F.Cu") (roundrect_rratio 0.01923076923) (tstamp c91a4918-7c7b-44c4-a8fe-15b574de971a))
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(pad "1" smd roundrect (at 0 0) (size 14.3 25.7) (layers "F.Cu") (roundrect_rratio 0.01923076923) (tstamp c91a4918-7c7b-44c4-a8fe-15b574de971a))
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)
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Production/PCB/chu_main_v1.2.zip
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Production/PCB/chu_main_v1.2.zip
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