(module "BGA-64-05P-ST" 
  (layer F.Cu) 
  (tedit 5FF3164B) 
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        (thickness 0.1500)))) 
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    (layer F.SilkS) 
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    (layer F.CrtYd) 
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    (at 1.2500 1.2500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad G8 smd circle 
    (at 1.7500 1.2500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H1 smd circle 
    (at -1.7500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H2 smd circle 
    (at -1.2500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H3 smd circle 
    (at -0.7500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H4 smd circle 
    (at -0.2500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H5 smd circle 
    (at 0.2500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H6 smd circle 
    (at 0.7500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H7 smd circle 
    (at 1.2500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)) 
  (pad H8 smd circle 
    (at 1.7500 1.7500) 
    (size 0.2800 0.2800) 
    (layers F.Cu F.Mask F.Paste) 
    (solder_mask_margin 0.0450)))