chip_shape: [4.5, 5.1]
description: |-
  TSSOP-14 from JEDEC MO-153 with thermal pad
  IPC-7351B: SOP65P640X120-14N
model:
  offset: [0, 0, 0]
  path: ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14-1EP_4.4x5mm_P0.65mm.step
  rotate: [0, 0, 0]
  scale: [1, 1, 1]
name: HTSSOP-14
pad_shape: [1.4, 0.3]
pin_pitch: 0.65
pin_shape: [0.95, 0.3]
ep_shape: [3.4, 5.0]
ep_mask_shape: [2.46, 2.31, 2, 2]
ep_paste_shape: [2.46, 2.31, 2, 2]
ep_vias: [0.3, 0.6, 0.9]
pins: 14
row_pitch: 5.7
rows: 2