popn_pico/PCB/agg-kicad/agg.pretty

PCB Footprints

Common Guidelines

• Origin/anchor on part centre
• Pad 1 on the left and then at the top
• Ensure rotational symmetry for symmetric parts
• Text has size 1mm x 1mm and thickness 0.15mm (checked automatically)
• Aim to conform to IPC-7351B footprint design
• Reference and Value fields:
  • On the F.Fab layer (checked automatically)
  • May only be hidden for non-functional parts such as mounting holes
  • Place just outside the part courtyard, without overlapping the part
  • If the part is usually arrayed vertically, place on left and right, with text running vertically
  • If the part is usually arrayed horizontally, place on top and bottom, with text horizontal
  • Otherwise, prefer top and bottom
  • Reference on top or left, value on bottom or right
• Fabrication Layer:
  • Include reasonably accurate part drawing
• Courtyard:
  • Lines 0.01mm thick on 0.05mm grid (checked automatically)
  • Clearance:
    • 0.25mm normally
    • Other clearances as applicable per-package
• Silkscreen:
  • May be omitted only for very small footprints where inclusion would impede close packing or soldering, or for non-functional parts such as mounting holes
  • All lines 0.15mm thick (checked automatically)
  • Provide pin 1 indicator where applicable
  • No silk over exposed copper
  • Internal drawings where possible
    • Not for ICs with exposed pads
    • Be careful of situations where the height of the silk could cause soldering issues
    • Placement alignment indications for no-lead packages will need to be external
    • In general prefer less silk visible post-assembly

Associated Documentation

• Has the footprint been validated in practice? With what symbol? Where?
• Link to any specific layout recommendations or requirements
• Any other notes / gotchas

Footprints in unchecked/ have not been standardised or documented yet.

Footprints

0201, 0201-L, 0402, 0402-L, 0603, 0603-L, 0805, 1206

Imperial sized chip device.

• Footprints are IPC-7351B compliant
• Default NOMINAL environment, -L parts in LEAST environment
• Clearance and courtyards are all 0.25mm from the pad edges
• Fabrication layer shows typical device and terminal size
• Generally all tested in production but are by no means process-optimised

0603-LED

0603 (aka 1.6mm x 0.8mm) sized LED.

• Standard 0603 footprint pads
• LED polarity arrow with pin 1 as cathode
• Farnell codes:
  • Red 2290329
  • Green 2290328
  • Amber 2290330 ("yellow")
  • Blue 1686062

0805-LED

0805 (aka 2.0mm x 1.25mm) sized LED.

• Standard 0805 footprint pads
• LED polarity arrow with pin 1 as cathode
• Farnell codes:
  • Red 5790840
  • Green 5790852
  • Yellow 5790876
  • Orange 5790864
  • Blue 8554749

SOIC, MSOP, LQFP, QFN, DFN, LGA, LPCC, others

Standard footprints, either from IPC-7351B in nominal environments or otherwise modified for a specific package or device.

Generated automatically by scripts/icmod.py. Please see the notes by each footprint in that script for further details.

MICROUSB_MOLEX_47589-0001

MicroUSB connector.

• Farnell 1568023
• Not tested yet
• Bottom mount (so USB cables will be upside down if footprint is on top)
• Footprint uses round drill hits for oblong slots
• Probably wants hand soldering the through connections

MICROSD_MOLEX_503398-1892

MicroSD card holder.

• Farnell 2358234
• Used successfully

M3_HOLE, M3_MOUNT

M3 sized mounting holes.

• The M3_MOUNT variant includes a no-mask region with extra drill hits for a locking washer.
• The M3_HOLE courtyard does not include space for a bolt head or washer (as it may not always be required) so be sure to check this or use the M3_MOUNT variant.

WIREPAD

3mm diameter circular copper pad. Useful for particularly large testpoints and pads for soldering wires to.

PowerFLAT5x6

Dual switching N-MOSFET (not linked), 9mΩ Rdson.

• STL15DN4F5
• http://www.st.com/web/en/resource/technical/document/datasheet/CD00279555.pdf

PowerPair3x3

Dual switching N-MOSFET totem pole, 14mΩ (upper) and 7mΩ (lower) Rdson.

• SiZ340DT
• http://www.vishay.com/docs/62877/siz340dt.pdf

PowerPAK SC-75-6L-Single

Single switching N/P MOSFET.

• SiB452DK, SiB433EDK
• http://www.vishay.com/docs/68832/sib452dk.pdf
• http://www.vishay.com/docs/65652/sib433ed.pdf

PowerPAK-SO-8

Single switching P-MOSFET, 3mΩ Rdson.

• Si7157DP
• http://www.vishay.com/docs/62860/si7157dp.pdf

SON2x2

Single switching P-MOSFET, 59mΩ Rdson.

• CSD25310Q2
• http://www.ti.com/lit/ds/symlink/csd25310q2.pdf

VML1006

Single switching N MOSFET.

• RV2C010UN
• http://rohmfs.rohm.com/en/products/databook/datasheet/discrete/transistor/mosfet/rv2c010unt2l-e.pdf

VLS201610HBX-1

VLS201610HBX-1 Inductor series.

• https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_power_vls201610hbx-1_en.pdf