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PCB Footprints

Common Guidelines

  • Origin/anchor on part centre
  • Pad 1 on the left and then at the top
  • Ensure rotational symmetry for symmetric parts
  • Text has size 1mm x 1mm and thickness 0.15mm (checked automatically)
  • Aim to conform to IPC-7351B footprint design
  • Reference and Value fields:
    • On the F.Fab layer (checked automatically)
    • May only be hidden for non-functional parts such as mounting holes
    • Place just outside the part courtyard, without overlapping the part
    • If the part is usually arrayed vertically, place on left and right, with text running vertically
    • If the part is usually arrayed horizontally, place on top and bottom, with text horizontal
    • Otherwise, prefer top and bottom
    • Reference on top or left, value on bottom or right
  • Fabrication Layer:
    • Include reasonably accurate part drawing
  • Courtyard:
    • Lines 0.01mm thick on 0.05mm grid (checked automatically)
    • Clearance:
      • 0.25mm normally
      • Other clearances as applicable per-package
  • Silkscreen:
    • May be omitted only for very small footprints where inclusion would impede close packing or soldering, or for non-functional parts such as mounting holes
    • All lines 0.15mm thick (checked automatically)
    • Provide pin 1 indicator where applicable
    • No silk over exposed copper
    • Internal drawings where possible
      • Not for ICs with exposed pads
      • Be careful of situations where the height of the silk could cause soldering issues
      • Placement alignment indications for no-lead packages will need to be external
      • In general prefer less silk visible post-assembly

Associated Documentation

  • Has the footprint been validated in practice? With what symbol? Where?
  • Link to any specific layout recommendations or requirements
  • Any other notes / gotchas

Footprints in unchecked/ have not been standardised or documented yet.

Footprints

0201, 0201-L, 0402, 0402-L, 0603, 0603-L, 0805, 1206

Imperial sized chip device.

  • Footprints are IPC-7351B compliant
  • Default NOMINAL environment, -L parts in LEAST environment
  • Clearance and courtyards are all 0.25mm from the pad edges
  • Fabrication layer shows typical device and terminal size
  • Generally all tested in production but are by no means process-optimised

0603-LED

0603 (aka 1.6mm x 0.8mm) sized LED.

  • Standard 0603 footprint pads
  • LED polarity arrow with pin 1 as cathode
  • Farnell codes:
    • Red 2290329
    • Green 2290328
    • Amber 2290330 ("yellow")
    • Blue 1686062

0805-LED

0805 (aka 2.0mm x 1.25mm) sized LED.

  • Standard 0805 footprint pads
  • LED polarity arrow with pin 1 as cathode
  • Farnell codes:
    • Red 5790840
    • Green 5790852
    • Yellow 5790876
    • Orange 5790864
    • Blue 8554749

SOIC, MSOP, LQFP, QFN, DFN, LGA, LPCC, others

Standard footprints, either from IPC-7351B in nominal environments or otherwise modified for a specific package or device.

Generated automatically by scripts/icmod.py. Please see the notes by each footprint in that script for further details.

MICROUSB_MOLEX_47589-0001

MicroUSB connector.

  • Farnell 1568023
  • Not tested yet
  • Bottom mount (so USB cables will be upside down if footprint is on top)
  • Footprint uses round drill hits for oblong slots
  • Probably wants hand soldering the through connections

MICROSD_MOLEX_503398-1892

MicroSD card holder.

  • Farnell 2358234
  • Used successfully

M3_HOLE, M3_MOUNT

M3 sized mounting holes.

  • The M3_MOUNT variant includes a no-mask region with extra drill hits for a locking washer.
  • The M3_HOLE courtyard does not include space for a bolt head or washer (as it may not always be required) so be sure to check this or use the M3_MOUNT variant.

WIREPAD

3mm diameter circular copper pad. Useful for particularly large testpoints and pads for soldering wires to.

PowerFLAT5x6

Dual switching N-MOSFET (not linked), 9mΩ Rdson.

PowerPair3x3

Dual switching N-MOSFET totem pole, 14mΩ (upper) and 7mΩ (lower) Rdson.

PowerPAK SC-75-6L-Single

Single switching N/P MOSFET.

PowerPAK-SO-8

Single switching P-MOSFET, 3mΩ Rdson.

SON2x2

Single switching P-MOSFET, 59mΩ Rdson.

VML1006

Single switching N MOSFET.

VLS201610HBX-1

VLS201610HBX-1 Inductor series.