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173 lines
4.9 KiB
Markdown
173 lines
4.9 KiB
Markdown
# PCB Footprints
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## Common Guidelines
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* Origin/anchor on part centre
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* Pad 1 on the left and then at the top
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* Ensure rotational symmetry for symmetric parts
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* Text has size 1mm x 1mm and thickness 0.15mm (checked automatically)
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* Aim to conform to IPC-7351B footprint design
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* Reference and Value fields:
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* On the `F.Fab` layer (checked automatically)
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* May only be hidden for non-functional parts such as mounting holes
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* Place just outside the part courtyard, without overlapping the part
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* If the part is usually arrayed vertically, place on left and right, with
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text running vertically
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* If the part is usually arrayed horizontally, place on top and bottom,
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with text horizontal
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* Otherwise, prefer top and bottom
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* Reference on top or left, value on bottom or right
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* Fabrication Layer:
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* Include reasonably accurate part drawing
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* Courtyard:
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* Lines 0.01mm thick on 0.05mm grid (checked automatically)
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* Clearance:
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* 0.25mm normally
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* Other clearances as applicable per-package
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* Silkscreen:
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* May be omitted only for very small footprints where inclusion would
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impede close packing or soldering, or for non-functional parts such as
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mounting holes
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* All lines 0.15mm thick (checked automatically)
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* Provide pin 1 indicator where applicable
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* No silk over exposed copper
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* Internal drawings where possible
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* Not for ICs with exposed pads
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* Be careful of situations where the height of the silk could cause
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soldering issues
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* Placement alignment indications for no-lead packages will need to be
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external
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* In general prefer less silk visible post-assembly
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## Associated Documentation
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* Has the footprint been validated in practice? With what symbol? Where?
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* Link to any specific layout recommendations or requirements
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* Any other notes / gotchas
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Footprints in `unchecked/` have not been standardised or documented yet.
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## Footprints
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### 0201, 0201-L, 0402, 0402-L, 0603, 0603-L, 0805, 1206
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Imperial sized chip device.
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* Footprints are IPC-7351B compliant
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* Default NOMINAL environment, `-L` parts in LEAST environment
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* Clearance and courtyards are all 0.25mm from the pad edges
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* Fabrication layer shows typical device and terminal size
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* Generally all tested in production but are by no means process-optimised
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### 0603-LED
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0603 (aka 1.6mm x 0.8mm) sized LED.
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* Standard 0603 footprint pads
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* LED polarity arrow with pin 1 as cathode
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* Farnell codes:
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* Red 2290329
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* Green 2290328
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* Amber 2290330 ("yellow")
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* Blue 1686062
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### 0805-LED
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0805 (aka 2.0mm x 1.25mm) sized LED.
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* Standard 0805 footprint pads
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* LED polarity arrow with pin 1 as cathode
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* Farnell codes:
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* Red 5790840
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* Green 5790852
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* Yellow 5790876
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* Orange 5790864
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* Blue 8554749
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### SOIC, MSOP, LQFP, QFN, DFN, LGA, LPCC, others
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Standard footprints, either from IPC-7351B in nominal environments or otherwise
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modified for a specific package or device.
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Generated automatically by `scripts/icmod.py`. Please see the notes by each
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footprint in that script for further details.
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### MICROUSB_MOLEX_47589-0001
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MicroUSB connector.
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* Farnell 1568023
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* Not tested yet
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* Bottom mount (so USB cables will be upside down if footprint is on top)
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* Footprint uses round drill hits for oblong slots
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* Probably wants hand soldering the through connections
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### MICROSD_MOLEX_503398-1892
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MicroSD card holder.
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* Farnell 2358234
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* Used successfully
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### M3_HOLE, M3_MOUNT
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M3 sized mounting holes.
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* The `M3_MOUNT` variant includes a no-mask region with extra drill hits for a
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locking washer.
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* The `M3_HOLE` courtyard does _not_ include space for a bolt head or washer
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(as it may not always be required) so be sure to check this or use the
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`M3_MOUNT` variant.
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### WIREPAD
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3mm diameter circular copper pad. Useful for particularly large testpoints and
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pads for soldering wires to.
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### PowerFLAT5x6
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Dual switching N-MOSFET (not linked), 9mΩ Rdson.
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* STL15DN4F5
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* http://www.st.com/web/en/resource/technical/document/datasheet/CD00279555.pdf
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### PowerPair3x3
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Dual switching N-MOSFET totem pole, 14mΩ (upper) and 7mΩ (lower) Rdson.
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* SiZ340DT
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* http://www.vishay.com/docs/62877/siz340dt.pdf
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### PowerPAK SC-75-6L-Single
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Single switching N/P MOSFET.
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* SiB452DK, SiB433EDK
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* http://www.vishay.com/docs/68832/sib452dk.pdf
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* http://www.vishay.com/docs/65652/sib433ed.pdf
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### PowerPAK-SO-8
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Single switching P-MOSFET, 3mΩ Rdson.
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* Si7157DP
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* http://www.vishay.com/docs/62860/si7157dp.pdf
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### SON2x2
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Single switching P-MOSFET, 59mΩ Rdson.
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* CSD25310Q2
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* http://www.ti.com/lit/ds/symlink/csd25310q2.pdf
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### VML1006
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Single switching N MOSFET.
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* RV2C010UN
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* http://rohmfs.rohm.com/en/products/databook/datasheet/discrete/transistor/mosfet/rv2c010unt2l-e.pdf
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### VLS201610HBX-1
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VLS201610HBX-1 Inductor series.
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* https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_power_vls201610hbx-1_en.pdf
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