(footprint "J4" (version 20221018) (generator pcbnew) (layer "F.Cu") (attr through_hole) (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))) (tstamp 5d8a21f2-50cc-4772-a7e3-896b9c7b6049) ) (fp_text value "J4" (at 0 1 unlocked) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp 8259887d-898b-498f-969d-4a6dc6b05bc0) ) (fp_text user "${REFERENCE}" (at 0 2.5 unlocked) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp 6360afcf-dc73-484e-8a00-6a0556a06224) ) (fp_line (start -5.01 -15.7) (end -5.01 -2.37) (stroke (width 0.3) (type default)) (layer "F.SilkS") (tstamp 4386cfcf-2cce-4e91-b943-b68f25ffa26c)) (fp_line (start -5.01 -2.385) (end 5.03 -2.385) (stroke (width 0.3) (type default)) (layer "F.SilkS") (tstamp bbff8b39-f739-4f0f-b9c7-6b795a92aa25)) (fp_line (start 5.03 -2.385) (end 5.03 -15.655) (stroke (width 0.3) (type default)) (layer "F.SilkS") (tstamp 83848150-861d-4442-a103-3ff5d18b6519)) (pad "1" smd rect (at -1.6075 -4.2475) (size 3.355 4.595) (layers "B.Cu" "B.Mask") (tstamp a3e8928f-0b79-4514-8997-14d09e2d8b1c)) (pad "1" thru_hole rect (at -0.07 -3.47 180) (size 4.82 1.84) (drill oval 4 1) (layers *.Mask "F.Cu" "In1.Cu" "B.Cu") (tstamp 9d35292f-a930-4d51-b108-10e4803b5833)) (pad "1" smd rect (at 1.88625 -4.73375) (size 3.8675 3.6075) (layers "B.Cu" "B.Mask") (tstamp 2f8d22c3-453d-4409-a023-56318021a8b6)) (pad "2" thru_hole rect (at -0.05 -9.46 180) (size 4 1.8) (drill oval 3.7 1) (layers *.Mask "F.Cu" "In1.Cu" "B.Cu") (tstamp 860fcf6e-f4c9-43c2-92ca-84071fae8710)) (pad "2" smd rect (at 0.2775 -9.9725 270) (size 6.325 7.045) (layers "B.Cu" "B.Mask") (tstamp dbab0b30-9f4e-41f0-8943-ed77d251e210)) (pad "3" smd rect (at -5.205 -6.975 270) (size 7.33 3.11) (layers "B.Cu" "B.Mask") (tstamp 948375d3-a36c-4540-bb61-fd4174c95aab)) (pad "3" thru_hole rect (at -4.95 -6.32 270) (size 4 1.8) (drill oval 3.7 1) (layers *.Mask "F.Cu" "In1.Cu" "B.Cu") (tstamp 5b62dd86-046e-47f2-8740-7bfe3fc2103c)) )