diff --git a/td-io.kicad_pcb b/td-io.kicad_pcb index cbfa209..23887c8 100644 --- a/td-io.kicad_pcb +++ b/td-io.kicad_pcb @@ -91,7 +91,7 @@ (mirror false) (drillshape 0) (scaleselection 1) - (outputdirectory "v1.1/")) + (outputdirectory "v1.2/")) ) (net 0 "") @@ -609,9 +609,9 @@ (fp_text user %R (at 0 0 90) (layer F.Fab) (effects (font (size 0.5 0.5) (thickness 0.08))) ) - (pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 188 +5VD)) - (pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 194 "Net-(R63-Pad2)")) (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl (at (xyz 0 0 0)) @@ -645,9 +645,9 @@ (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 0.5 0.5) (thickness 0.08))) ) - (pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 8 +3V3)) - (pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 193 /i2c_scl)) (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl (at (xyz 0 0 0)) @@ -681,9 +681,9 @@ (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 0.5 0.5) (thickness 0.08))) ) - (pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 8 +3V3)) - (pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902) + (pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341) (net 192 /i2c_sda)) (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl (at (xyz 0 0 0)) @@ -2430,10 +2430,10 @@ (fp_text user %R (at 0 0) (layer F.Fab) (effects (font (size 0.98 0.98) (thickness 0.15))) ) - (pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376)) - (pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376)) - (pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376)) - (pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376)) + (pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277)) + (pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277)) + (pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277)) + (pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277)) (pad 9 smd rect (at 0 0) (size 1.9 2.9) (layers B.Cu) (net 1 GND)) (pad 9 thru_hole circle (at 0.7 1.2) (size 0.5 0.5) (drill 0.2) (layers *.Cu) @@ -9101,7 +9101,7 @@ (segment (start 200.865 101.425) (end 200.865 100.55) (width 0.25) (layer F.Cu) (net 194)) (segment (start 204.72499 100.22499) (end 205.5 101) (width 0.25) (layer F.Cu) (net 194)) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 6074EF6E) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 61AE7233) (hatch edge 0.508) (connect_pads (clearance 0.2)) (min_thickness 0.1) (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508)) @@ -13326,7 +13326,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 6074EF6B) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 61AE7230) (hatch edge 0.508) (connect_pads (clearance 0.2)) (min_thickness 0.2) (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508)) @@ -14861,7 +14861,7 @@ ) ) ) - (zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 6074EF68) (hatch edge 0.508) + (zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 61AE722D) (hatch edge 0.508) (priority 1) (connect_pads yes (clearance 0.1)) (min_thickness 0.254) @@ -14882,7 +14882,7 @@ ) ) ) - (zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 6074EF65) (hatch edge 0.508) + (zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 61AE722A) (hatch edge 0.508) (priority 1) (connect_pads yes (clearance 0.1)) (min_thickness 0.254) @@ -14936,7 +14936,7 @@ ) ) ) - (zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 6074EF62) (hatch edge 0.508) + (zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 61AE7227) (hatch edge 0.508) (priority 1) (connect_pads yes (clearance 0.1)) (min_thickness 0.254)