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21 lines
482 B
YAML
21 lines
482 B
YAML
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chip_shape: [4.5, 5.1]
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description: |-
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TSSOP-14 from JEDEC MO-153 with thermal pad
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IPC-7351B: SOP65P640X120-14N
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model:
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offset: [0, 0, 0]
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path: ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14-1EP_4.4x5mm_P0.65mm.step
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rotate: [0, 0, 0]
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scale: [1, 1, 1]
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name: HTSSOP-14
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pad_shape: [1.4, 0.3]
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pin_pitch: 0.65
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pin_shape: [0.95, 0.3]
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ep_shape: [3.4, 5.0]
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ep_mask_shape: [2.46, 2.31, 2, 2]
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ep_paste_shape: [2.46, 2.31, 2, 2]
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ep_vias: [0.3, 0.6, 0.9]
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pins: 14
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row_pitch: 5.7
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rows: 2
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