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popn_pico/PCB/agg-kicad/mod/ic/qfn-32-ep-st.yaml
2022-08-22 21:51:48 +08:00

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641 B
YAML

chip_shape: [5.1, 5.1]
description: |-
UFQFPN-32 from JEDEC MO-220
Modified to meet the ST ECOPACK package of the same name:
* Row pitch is 6.75mm instead of 7.0mm
* Pads are 0.55mm long instead of 0.8mm
* EP is 5.6mm
IPC-7351B: QFN50P700X700X80-33N
ep_mask_shape: [2.0, 2.0, 0.5, 0.5]
ep_paste_shape: [1.0, 1.0, 1.5, 1.5]
ep_shape: [3.45, 3.45]
ep_vias: [0.4, 0.6, 1.9]
model:
offset: [0, 0, 0]
path: ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-32-1EP_5x5mm_Pitch0.5mm.wrl
rotate: [0, 0, 0]
scale: [1, 1, 1]
name: QFN-32-EP-ST
pad_shape: [0.6, 0.3]
pin_pitch: 0.5
pin_shape: [-0.5, 0.28]
pins: 32
row_pitch: 4.7
rows: 4