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This commit is contained in:
Thomas Daede 2021-12-07 04:39:55 -08:00
parent d99f1a55b5
commit 82cb2b4572
1 changed files with 16 additions and 16 deletions
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32
td-io.kicad_pcb
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@ -91,7 +91,7 @@
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "v1.1/"))
(outputdirectory "v1.2/"))
)
(net 0 "")
@ -609,9 +609,9 @@
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.5 0.5) (thickness 0.08)))
)
(pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 188 +5VD))
(pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 194 "Net-(R63-Pad2)"))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
(at (xyz 0 0 0))
@ -645,9 +645,9 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.5 0.5) (thickness 0.08)))
)
(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 8 +3V3))
(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 193 /i2c_scl))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
(at (xyz 0 0 0))
@ -681,9 +681,9 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.5 0.5) (thickness 0.08)))
)
(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 8 +3V3))
(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
(net 192 /i2c_sda))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
(at (xyz 0 0 0))
@ -2430,10 +2430,10 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.98 0.98) (thickness 0.15)))
)
(pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
(pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
(pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
(pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
(pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
(pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
(pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
(pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
(pad 9 smd rect (at 0 0) (size 1.9 2.9) (layers B.Cu)
(net 1 GND))
(pad 9 thru_hole circle (at 0.7 1.2) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
@ -9101,7 +9101,7 @@
(segment (start 200.865 101.425) (end 200.865 100.55) (width 0.25) (layer F.Cu) (net 194))
(segment (start 204.72499 100.22499) (end 205.5 101) (width 0.25) (layer F.Cu) (net 194))
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 6074EF6E) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 61AE7233) (hatch edge 0.508)
(connect_pads (clearance 0.2))
(min_thickness 0.1)
(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508))
@ -13326,7 +13326,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 6074EF6B) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 61AE7230) (hatch edge 0.508)
(connect_pads (clearance 0.2))
(min_thickness 0.2)
(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508))
@ -14861,7 +14861,7 @@
)
)
)
(zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 6074EF68) (hatch edge 0.508)
(zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 61AE722D) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.1))
(min_thickness 0.254)
@ -14882,7 +14882,7 @@
)
)
)
(zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 6074EF65) (hatch edge 0.508)
(zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 61AE722A) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.1))
(min_thickness 0.254)
@ -14936,7 +14936,7 @@
)
)
)
(zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 6074EF62) (hatch edge 0.508)
(zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 61AE7227) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.1))
(min_thickness 0.254)