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parent
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@ -91,7 +91,7 @@
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(mirror false)
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(drillshape 0)
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(scaleselection 1)
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(outputdirectory "v1.1/"))
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(outputdirectory "v1.2/"))
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)
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(net 0 "")
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@ -609,9 +609,9 @@
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(fp_text user %R (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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)
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(pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 1 smd roundrect (at -0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 188 +5VD))
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(pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 2 smd roundrect (at 0.9125 0 90) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 194 "Net-(R63-Pad2)"))
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(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
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(at (xyz 0 0 0))
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@ -645,9 +645,9 @@
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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)
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(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 8 +3V3))
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(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 193 /i2c_scl))
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(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
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(at (xyz 0 0 0))
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@ -681,9 +681,9 @@
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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)
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(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 1 smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 8 +3V3))
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(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.243902)
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(pad 2 smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2439014634146341)
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(net 192 /i2c_sda))
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(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
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(at (xyz 0 0 0))
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@ -2430,10 +2430,10 @@
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.98 0.98) (thickness 0.15)))
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)
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(pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
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(pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
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(pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
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(pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475237623762376))
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(pad "" smd roundrect (at 0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
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(pad "" smd roundrect (at 0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
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(pad "" smd roundrect (at -0.6 0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
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(pad "" smd roundrect (at -0.6 -0.825) (size 1.01 1.38) (layers F.Paste) (roundrect_rratio 0.2475227722772277))
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(pad 9 smd rect (at 0 0) (size 1.9 2.9) (layers B.Cu)
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(net 1 GND))
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(pad 9 thru_hole circle (at 0.7 1.2) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
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@ -9101,7 +9101,7 @@
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(segment (start 200.865 101.425) (end 200.865 100.55) (width 0.25) (layer F.Cu) (net 194))
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(segment (start 204.72499 100.22499) (end 205.5 101) (width 0.25) (layer F.Cu) (net 194))
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(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 6074EF6E) (hatch edge 0.508)
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(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 61AE7233) (hatch edge 0.508)
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(connect_pads (clearance 0.2))
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(min_thickness 0.1)
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(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508))
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@ -13326,7 +13326,7 @@
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)
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)
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)
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(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 6074EF6B) (hatch edge 0.508)
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(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 61AE7230) (hatch edge 0.508)
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(connect_pads (clearance 0.2))
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(min_thickness 0.2)
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(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.508))
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@ -14861,7 +14861,7 @@
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)
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)
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)
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(zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 6074EF68) (hatch edge 0.508)
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(zone (net 115) (net_name /SW) (layer F.Cu) (tstamp 61AE722D) (hatch edge 0.508)
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(priority 1)
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(connect_pads yes (clearance 0.1))
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(min_thickness 0.254)
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@ -14882,7 +14882,7 @@
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)
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)
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)
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(zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 6074EF65) (hatch edge 0.508)
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(zone (net 150) (net_name +5VL) (layer F.Cu) (tstamp 61AE722A) (hatch edge 0.508)
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(priority 1)
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(connect_pads yes (clearance 0.1))
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(min_thickness 0.254)
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@ -14936,7 +14936,7 @@
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)
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)
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)
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(zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 6074EF62) (hatch edge 0.508)
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(zone (net 115) (net_name /SW) (layer B.Cu) (tstamp 61AE7227) (hatch edge 0.508)
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(priority 1)
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(connect_pads yes (clearance 0.1))
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(min_thickness 0.254)
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